Installation Instructions
Table Of Contents
- Contents
- List of Table
- List of Figures
- 1 About this document
- 2 Product Overview
- 3 Mechanical Dimensions
- 4 Interface description
- 4.1 Pin Definition
- 4.2 Operating conditions
- 4.3 Digital logic characteristics
- 4.4 Power interface
- 4.5 USIM card interface
- 4.6 PCM interface
- 4.7 USB2.0 interface
- 4.8 UART interface
- 4.9 SPI interface
- 4.10 I2C interface
- 4.11 Network light
- 4.12 System Status Indication
- 4.13 Flight Mode
- 4.14 Forced USB download interface
- 4.15 SD card interface
- 4.16 SDIO_WIFI/EMMC interface
- 4.17 PCIe interface
- 4.18 RMII/RGMII interface
- 4.19 AUDIO interface
- 4.20 ADC
- 4.21 GPIOs
- 4.22 Power on/off and reset interface
- 4.23 Antenna interface
- 5 Product characteristics
- 6 Design Guideline
- 7 Storage, Production and Package
- 8 Safety Information
- 空白页面
- 空白页面
L508 Hardware Design
Copyright© Shanghai Mobiletek Communication Ltd 95
For SMT quality, Please ensure the necessary condition according to actual condition of factory
before SMT, like SMT pressure, speed (very important), stencil ways.
We must use the reflow oven more than 8 temperature zones, and strictly control the furnace
temperature curve.
Recommended temperature:
B. constant temperature zone: temperature 140-210°C, time: 60s-120s.
E. recirculation zone: PEAK temperature 220-245°C, time: 45s-75s.
Figure 47 Temperature Curve
Notes: Customer’s board deformation must be controlled well. By reducing the number of imposition
or increasing patch clamp to reduce the deformation.
Module thickness of the stencil is recommended to be thickened, and the rest position can be
maintained by 0.1mm.