Installation Instructions
Table Of Contents
- Contents
- List of Table
- List of Figures
- 1 About this document
- 2 Product Overview
- 3 Mechanical Dimensions
- 4 Interface description
- 4.1 Pin Definition
- 4.2 Operating conditions
- 4.3 Digital logic characteristics
- 4.4 Power interface
- 4.5 USIM card interface
- 4.6 PCM interface
- 4.7 USB2.0 interface
- 4.8 UART interface
- 4.9 SPI interface
- 4.10 I2C interface
- 4.11 Network light
- 4.12 System Status Indication
- 4.13 Flight Mode
- 4.14 Forced USB download interface
- 4.15 SD card interface
- 4.16 SDIO_WIFI/EMMC interface
- 4.17 PCIe interface
- 4.18 RMII/RGMII interface
- 4.19 AUDIO interface
- 4.20 ADC
- 4.21 GPIOs
- 4.22 Power on/off and reset interface
- 4.23 Antenna interface
- 5 Product characteristics
- 6 Design Guideline
- 7 Storage, Production and Package
- 8 Safety Information
- 空白页面
- 空白页面
L508 Hardware Design
Copyright© Shanghai Mobiletek Communication Ltd 93
Table 49 Baking Conditions
Baking
conditions
125±5°C / 5%RH 45±5°C / 5%RH
Baking time 8 hours 192 hours
Description Not use the original tray
Can use the original tray
Notes: The original anti-ESD tray temperature does not exceed 50°C. Otherwise the tray will be
deformed.
The anti-ESD tray of the original packaging is only used for packaging, and can’t be used as a
SMT tray.
During taking and placing, please take notes of ESD and cannot be placed as overlay.
Customer product maintenance
If maintenance module after SMT, it is easy for damp module to damage when removing, so the
module disassembly and other related maintenance operations should complete within 48 hours after
SMT, or need to bake and then maintenance the module.
Because the module return from the field work can’t ensure the dry state, it must be baked in
accordance with the conditions of baking, then for disassembly and maintenance. If it has been
exposed to the humid environment for a long time, please properly extend the baking time, such as
125°C/36 hours.
7.2.2 SMT reflow attentions
The module has the BGA chips, chip resistances and capacitances internally, which will melt at high
temperature. If module melt completely encountered a large shock, such as excessive vibration of
reflux conveyor belt or hit the board, internal components will easily shift or be false welding. So,
using intelligent modules over the furnace need to pay attention to:
Modules can’t be vibrate larger, namely customer requirements as far as possible in orbit (chain)
furnace, furnace, avoid on the barbed wire furnace, in order to ensure smooth furnace.