Installation Instructions
Table Of Contents
- Contents
- List of Table
- List of Figures
- 1 About this document
- 2 Product Overview
- 3 Mechanical Dimensions
- 4 Interface description
- 4.1 Pin Definition
- 4.2 Operating conditions
- 4.3 Digital logic characteristics
- 4.4 Power interface
- 4.5 USIM card interface
- 4.6 PCM interface
- 4.7 USB2.0 interface
- 4.8 UART interface
- 4.9 SPI interface
- 4.10 I2C interface
- 4.11 Network light
- 4.12 System Status Indication
- 4.13 Flight Mode
- 4.14 Forced USB download interface
- 4.15 SD card interface
- 4.16 SDIO_WIFI/EMMC interface
- 4.17 PCIe interface
- 4.18 RMII/RGMII interface
- 4.19 AUDIO interface
- 4.20 ADC
- 4.21 GPIOs
- 4.22 Power on/off and reset interface
- 4.23 Antenna interface
- 5 Product characteristics
- 6 Design Guideline
- 7 Storage, Production and Package
- 8 Safety Information
- 空白页面
- 空白页面
L508 Hardware Design
Copyright© Shanghai Mobiletek Communication Ltd 92
The module is a humidity sensitive device. If the device needs reflow soldering, disassembly and
maintenance, we must strictly comply with the requirements of humidity sensitive device. If module is
damp, a reflow soldering or using a hot-air gun maintenance will lead to internal damage, because
the water vapor has the rapid expansion of the burst, causing physical injury to the device, like PCB
foaming and BGA component fail. So customers should refer to the following recommendations.
7.2.1 Module confirmation and moisture
The module in the production and packaging process should be strictly accordance with the humidity
sensitive device operation. The factory packaging is vacuum bag, desiccant, and humidity indicator
card. Please pay attention to the moisture control before SMT and the confirmation of the following
aspects.
Demand of Baking confirmation
Smart module uses vacuum sealed bag, which can make it stored for 12 months under the condition
of temp 40°C and humidity < 90%. The module should be baked before reflowing soldering if any of
the conditions below happen.
1. Storage exceeds the time limit.
2. Package damages and vacuum bags have air leakage.
3. Humidity indicating card change the color at 10%.
4. Module is placed naked in the air over 168 hours.
5. Module is placed naked in the air under 168 hours but not temp 30°C and humidity < 60%.
Baking condition confirmation
The moisture proof level of the smart module is level 3. And the baking conditions are as follows.