Installation Instructions
Table Of Contents
- Contents
- List of Table
- List of Figures
- 1 About this document
- 2 Product Overview
- 3 Mechanical Dimensions
- 4 Interface description
- 4.1 Pin Definition
- 4.2 Operating conditions
- 4.3 Digital logic characteristics
- 4.4 Power interface
- 4.5 USIM card interface
- 4.6 PCM interface
- 4.7 USB2.0 interface
- 4.8 UART interface
- 4.9 SPI interface
- 4.10 I2C interface
- 4.11 Network light
- 4.12 System Status Indication
- 4.13 Flight Mode
- 4.14 Forced USB download interface
- 4.15 SD card interface
- 4.16 SDIO_WIFI/EMMC interface
- 4.17 PCIe interface
- 4.18 RMII/RGMII interface
- 4.19 AUDIO interface
- 4.20 ADC
- 4.21 GPIOs
- 4.22 Power on/off and reset interface
- 4.23 Antenna interface
- 5 Product characteristics
- 6 Design Guideline
- 7 Storage, Production and Package
- 8 Safety Information
- 空白页面
- 空白页面
L508 Hardware Design
Copyright© Shanghai Mobiletek Communication Ltd 87
5.3 Working and storage temperature
The working storage temperature of this product is shown in Table 47.
Table 46 Operating temperature
Parameters Min Typ
Max
Unit
Normal operation
temperature
-40 25 85 ℃
Storage temperature -45 25 90 ℃
Note: when the operating temperature exceeds the operating temperature of the module, some of the
RF performance of the module may deteriorate, and may cause shutdown, restart and other faults.
5.4 Electrostatic protection
L508 is electrostatic sensitive device, therefore, the user in the production, assembly and operation of
the module must pay attention to the electrostatic protection. L506 ESD performance parameters in
the following table:
Table 47 ESD performance parameters (temperature: 25 °C, humidity: 45%)
Pin Contact discharge Air Discharge
VBAT GND ±5KV ±10KV
Other PADS ±0.5KV ±1KV