Installation Instructions

L508 Hardware Design
Copyright© Shanghai Mobiletek Communication Ltd 5
4.20 ADC ...................................................................................................................................................... 68
4.21 GPIOs .................................................................................................................................................. 69
4.22 Power on/off and reset interface .................................................................................................. 71
4.22.1 Pin Description ......................................................... 71
4.22.2 Power-on sequence ..................................................... 72
4.22.3 Power-off sequence .................................................... 73
4.22.4 Reset sequence ........................................................ 74
4.22.5 Interface application .................................................... 74
4.23 Antenna interface ............................................................................................................................. 76
4.23.1 RF signal PCB layout guide ............................................. 76
4.23.2 Interface application .................................................... 77
4.23.3 Antenna Layout guideline ............................................... 79
5 PRODUCT CHARACTERISTICS ........................... 81
5.1 Absolute maximum ratings .............................................................................................................. 81
5.2 Operating conditions ......................................................................................................................... 81
5.2.1 Operating conditions .................................................... 81
5.2.2 Work mode .............................................................. 81
5.2.3 Current consumption (TBD) .............................................. 83
5.3 Working and storage temperature ................................................................................................. 87
5.4 Electrostatic protection .................................................................................................................... 87
6 DESIGN GUIDELINE ..................................... 88
6.1 General Design rules and requirements ...................................................................................... 88
6.2 Circuit reference design ................................................................................................................... 88
6.3 RF circuit design ................................................................................................................................ 88
6.3.1 Matters needing attention in the initial stage of antenna design ............. 88
6.4 EMC AND ESD design recommendations .................................................................................... 90
6.5 Product Recommendation Upgrade Program ............................................................................. 90
7 STORAGE, PRODUCTION AND PACKAGE ................. 91
7.1 Storage .................................................................................................................................................. 91
7.2 Production ............................................................................................................................................ 91
7.2.1 Module confirmation and moisture ........................................ 92
7.2.2 SMT reflow attentions .................................................... 93
7.2.3 SMT stencil design and the problem of less tin soldering ................... 94
7.2.4 SMT attentions .......................................................... 94
7.3 Packaging Information ...................................................................................................................... 96
8 SAFETY INFORMATION .................................. 97