Installation Instructions
Table Of Contents
- Contents
- List of Table
- List of Figures
- 1 About this document
- 2 Product Overview
- 3 Mechanical Dimensions
- 4 Interface description
- 4.1 Pin Definition
- 4.2 Operating conditions
- 4.3 Digital logic characteristics
- 4.4 Power interface
- 4.5 USIM card interface
- 4.6 PCM interface
- 4.7 USB2.0 interface
- 4.8 UART interface
- 4.9 SPI interface
- 4.10 I2C interface
- 4.11 Network light
- 4.12 System Status Indication
- 4.13 Flight Mode
- 4.14 Forced USB download interface
- 4.15 SD card interface
- 4.16 SDIO_WIFI/EMMC interface
- 4.17 PCIe interface
- 4.18 RMII/RGMII interface
- 4.19 AUDIO interface
- 4.20 ADC
- 4.21 GPIOs
- 4.22 Power on/off and reset interface
- 4.23 Antenna interface
- 5 Product characteristics
- 6 Design Guideline
- 7 Storage, Production and Package
- 8 Safety Information
- 空白页面
- 空白页面
L508 Hardware Design
Copyright© Shanghai Mobiletek Communication Ltd 32
power-on Button. Active low
87 RESERVED -- -- Reserved for other purposes, Keep it open
LGA PIN
88 GND -- -- Ground pad for heat dissipation
89 GND -- -- Ground pad for heat dissipation
90 GND -- -- Ground pad for heat dissipation
91 GND -- -- Ground pad for heat dissipation
92 GND -- -- Ground pad for heat dissipation
93 GND -- -- Ground pad for heat dissipation
94 GND -- -- Ground pad for heat dissipation
95 GND -- -- Ground pad for heat dissipation
96 GND -- -- Ground pad for heat dissipation
97 GND -- -- Ground pad for heat dissipation
98 GND -- -- Ground pad for heat dissipation
99 GND -- -- Ground pad for heat dissipation
100 RMII_RX_CTRL B_PU
RMII_L
DO
Collision and Data Valid
101 RMII_RXD0 B_PU
RMII_L
DO
Receive Data 0
102 RMII_RXD1 B_PU
RMII_L
DO
Receive Data 1
103 RMII_CLK B_PU
RMII_L
DO
Reference clock
104 RMII_TXD0 B_PU
RMII_L
DO
Transmit data 0
105 RMII_TXD1 B_PU
RMII_L
DO
Transmit data 1