Datasheet

LUXEON Rebel General Purpose Datasheet DS64 (09/07/19) 9
Table 7.
Profile Feature Lead Free Assembly
Average Ramp-Up Rate (Ts
max
to T
p
) 3°C / second max
Preheat Temperature Min (Ts
min
) 150°C
Preheat Temperature Max (Ts
max
) 200°C
Preheat Time (ts
min
to ts
max
) 60 - 180 seconds
Time Maintained Above Temperature (T
L
) 217°C
Time Maintained Above Time (t
L
) 60 - 150 seconds
Peak / Classification Temperature (T
P
) 260°C
Time Within 5°C of Actual Peak Temperature (t
P
) 20 - 40 seconds
Ramp-Down Rate 6°C / second max
Time 25°C to Peak Temperature 8 minutes max
Note for Table 7:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
Reflow Soldering Characteristics
JEDEC 020c