Datasheet

Lumimicro 5050 ? Three Chip Specification
◆ Reliability Results
ITEMS CONDITION NOTE Fail/Sample
RESISTANCE TO SOLDERING HEAT
TSID=260℃ , 10sec
1
(REFLOW SOLDERING)
(PRE TREATMENT 30℃, 70%, 168hr)
2TIMES 0/50
SOLDERBILITY
TSID=215℃¡5 ℃, 3sec
2
(REFLOW SOLDERING) (LEAD SOLDER)
1TIME OVER 95% 0/50
THERMAL SHOCK
-40℃ ~ 100℃, 15min
3
AT EACH TEMP.
20CYCLES 0/50
MOISTURE RESISTANCE CYCLE
25℃ ~ 65℃ ~ -10℃, 90%RH
4
24hr/ 1cycle
20CYCLES 0/50
5 HIGH TEMPERATURE STORAGE
Ta = 100℃
1,000HRS 0/50
6
TEMPERATURE HUMIDITY
STORAGE
Ta = 60℃ , RH = 90%
1,000HRS 0/50
7 LOW TEMPERATURE STORAGE
Ta = -40℃
1,000HRS 0/50
8 LIFE TIME 1 20mA @ ROOM TEMP. 1,000HRS 0/50
9 LIFE TIME 2
15mA @ 60℃, 90%RH
1,000HRS 0/50
IF = 20mA , Pulse Width 2sec,
10 ON/OFF TEST
Duty Ratio 1/2
100,000CYCLES 0/50
◆ Failure Criteria
Failure Criteria
ITEM SYMBOL
MIN MAX
Forward Voltage VF - U.S.L*)¡1.2
C.I.E. x, y x, y L.S.L*)¡0.8 U.S.L*)¡1.2
Luminous Intensity IV L.S.L*)¡0. 7 -
U.S.L*) ; Upper Standard Level
L.S.L*) ; Lower Standard Level
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