Datasheet

DS204 LUXEON 3535 2D Product Datasheet 20141120 ©2015 Lumileds Holding B.V. All rights reserved. 6
Reow Soldering Characteristics
Table 6. Reow Prole in Accordance with J-Std-020D.
Prole Feature Lead Free Assembly
Preheat/Soak :
Temperature Min (T
smin
)
Temperature Max (T
smax
)
Maximum Time (t
s
) from T
smin
to T
smax
150°C
200°C
120 seconds
Ramp-up Rate (T
L
to T
p
) 3°C / second
Liquidous Temperature (T
L
) 217°C
Maximum Time (t
L
) Maintained above T
L
150 seconds
Maximum Peak Package Body Temperature (T
p
) 260°C
Time (t
p
) within 5°C of the specied temperature (T
c
) 10-30 seconds
Maximum Ramp-Down Rate (T
p
to T
L
) 6°C / second
Maximum Time 25°C to Peak Temperature 8 minutes
Note for Table 6:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
0
50
100
150
200
250
300
050 100 150 200 250 300
Temperature (C)
Time (seconds)
T
L
: 217°C
255°C +5/-0°C
260°C +0/-5°C
t
s
: 60-120sec.
t
L
: 60-150 sec,max
t
p
: 10-30sec. 30sec max.
T
smin
: 150°C
Ramp-Up Rate, 3°C/sec. max.
T
smax
:200°C
T
p
: 260°C
Temperature prole for Table 6.