Datasheet

DS061 LUXEON Rebel ES Product Datasheet 20140728 ©2015 Lumileds Holding B.V. All rights reserved. 8
Reow Soldering Characteristics
Temperature prole for Table 8.
Table 8.
Prole Feature Lead Free Assembly
Average Ramp-Up Rate (Ts
max
to T
p
) 3°C / second max
Preheat Temperature Min (Ts
min
) 150°C
Preheat Temperature Max (Ts
max
) 200°C
Preheat Time (ts
min
to ts
max
) 60 - 180 seconds
Temperature (T
L
) 217°C
Time Maintained Above Temperature (T
L
) 60 - 150 seconds
Peak / Classication Temperature (T
P
) 260°C
Time Within 5°C of Actual Peak Temperature (t
P
) 20 - 40 seconds
Ramp - Down Rate 6°C / second max
Time 25°C to Peak Temperature 8 minutes max
Notes for Table 8:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
2. For additional information on thermal measurement guidelines please refer to Application Brief AB33.
JEDEC
020c