Datasheet
LUXEON LED Assembly and Handling Application Brief AB32 20121217 21
Board warpage can be minimized by understanding how different CTE materials are stacked up. For example, when an FR4 board is sandwiched
between two full copper sheets, adding thin isolation lines in the copper sheet to create copper islands can minimize board warpage as shown in
Figure 28.
Copper isolaon
Copper isolation
Figure 28. Copper islands can help reduce board warpage.