Datasheet

LUXEON LED Assembly and Handling Application Brief AB32 20121217 15
3.4 Component Spacing
For the open via PTH design, the minimal edge to edge spacing is 4mm to maintain the thermal properties, see Figure 17. Spacing below 4 mm
results in fewer vias between the components, thus increasing thermal resistance.
For filled and capped vias with the above recommended design, the minimal edge to edge spacing is 0.3mm, see Figure 18. This board design yields
higher component density while still achieving a low thermal resistance.
Figure 17. Illustration of edge to edge spacing. The thermal resistance will increase dramatically if the spacing is less than 4mm edge to edge.
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