Datasheet
DS101 LUXEON R Product Datasheet 20140709 ©2015 Lumileds Holding B.V. All rights reserved. 5
Reow Soldering Characteristics
Table 6.
Prole Feature Lead Free Assembly
Average Ramp-Up Rate ( Ts
max
to T
p
) 3°C / second max
Preheat Temperature Min ( Ts
min
) 150°C
Preheat Temperature Max ( Ts
max
) 200°C
Preheat Time ( ts
min
to ts
max
) 60 - 180 seconds
Temperature (T
L
) 217°C
Time Maintained Above Temperature ( T
L
) 60 - 150 seconds
Peak / Classication Temperature ( T
P
) 260°C
Time Within 5°C of Actual Peak Temperature ( t
P
) 20 - 40 seconds
Ramp-Down Rate 6°C / second max
Time 25°C to Peak Temperature 8 minutes max
Notes for Table 6:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
Temperature Prole for Table 6.