Datasheet

DS206 LUXEON 3535 HV Product Datasheet 20140323 ©2015 Lumileds Holding B.V. All rights reserved. 7
Solder Pad Design
Notes for Figure 3:
1. The drawing above shows the recommend solder pad layout on the Printed Circuit Board (PCB).
2. All dimensions are in millimeters.
3. Application Brief AB203 provides details for this layout. In addition, the .drawing les are available at www.lumileds.com.
Package Information
Table 6. Package Information for L135-xx80-0xHV-00001
Material/Component Specication
Lead Frame Base
Package Body
Encapsulate
Weight
Copper Alloy
High Temperature Thermal Plastic
Silicone Resin, with Phosphor
0.08gram
Figure 3. Solder pad layout.