Datasheet

DS206 LUXEON 3535 HV Product Datasheet 20140323 ©2015 Lumileds Holding B.V. All rights reserved. 5
Reow Soldering Characteristics
Table 5. Reow Prole in Accordance with J-Std-020D
Prole Feature Lead Free Assembly
Preheat/Soak:
Temperature Min (Ts
min
)
Temperature Max (Ts
max
)
Maximum Time (ts) from Ts
min
to Ts
max
150°C
200°C
120 seconds
Ramp–up Rate (T
L
to T
p
) 3°C / second
Liquidous Temperature ( T
L
) 217°C
Maximum Time (t
L
) Maintained T
L
150 seconds
Maximum Peak Package Body Temperature (T
p
) 260°C
Time (t
p
) within 5°C of the specied temperature (T
c
) 10 - 30 seconds
Maximum Ramp-Down Rate (T
p
to T
L
) 6°C / second
Maximum Time 25°C to Peak Temperature 8 min utes
Notes for Table 5:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
Figure 1. Temperature prole for Table 5.