Datasheet

DS208 LUXEON 3014 Product Datasheet 20141216 ©2015 Lumileds Holding B.V. All rights reserved. 7
Solder Pad Design
Notes for Figure 3:
1. The drawing above shows the recommend solder pad layout on the Printed Circuit Board (PCB).
2. Application Brief AB208 provides extensive details for this layout. In addition, the .drawing les are available at www.lumileds.com.
Package Information
Table 6. Package Information for L130-xx800014-00001
Material/Component Specication
Lead Frame Base
Package Body
Encapsulate
Weight
Copper Alloy
High Temperature Thermal Plastic
Silicone Resin, with Phosphor
0.008gram
Figure 3.