Datasheet

DS209 LUXEON 3020 Product Datasheet 20150313 ©2015 Lumileds Holding B.V. All rights reserved. 7
Solder Pad Design
Notes for Figure 3:
1. All dimensions are in millimeters.
2. The drawing above shows the recommend solder pad layout on the Printed Circuit Board (PCB).
3. Application Brief AB209 provides details for this layout. In addition, the .drawing les are available at www.lumileds.com.
Package Information
Table 6. Package Information for L130-xx800020102R1
Material/Component Specication
Lead Frame Base
Package Body
Encapsulate
Weight
Copper Alloy
High Temperature Thermal Plastic
Silicone Resin, with Phosphor
0.01 gram
Notes for Table 6:
1. All dimensions are in millimeters.
2. Tolerance ±0.10mm.
Figure 3. Solder pad layout.