Users Manual
Table Of Contents
- Wi-Fi Module List
- 1 Device Overview
- Table of Contents
- Table of Figures
- Table of Tables
- 2 Module Configuration and Functions
- 3 Specifications
- 4 Application, Implementation, and Layout
- 5 Certificates
- 6 Revision History
- 7 Contact Us
RF-WM-10AFB1
www.szrfstar.com Ver1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 20 of 25
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in the performance of the module, even causing the failure.
4.9 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or
equivalent methods.
3. Solder paste composition: Sn/3.0 Ag/0.5 Cu
4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
5. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
6. Peak temperature: 245 ℃.
Figure 11. Recommended Reflow for Lead-Free Solder