Datasheet

Technical Data Sheet
LOCTITE
®
480™
January-2017
PRODUCT DESCRIPTION
LOCTITE
®
480™ provides the following product
characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl cyanoacrylate
Appearance (uncured) Black liquid
LMS
Components One part - requires no mixing
Viscosity Low
Cure Humidity
Application Bonding
Key Substrates Metals , Plastics and Rubbers
LOCTITE
®
480™ is a rubber toughened adhesive with
increased flexibility and peel strength along with enhanced
resistance to shock.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.05
Flash Point - See SDS
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 1,000 s
-1
100 to 200
LMS
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Spindle 1, speed 6 rpm 100 to 200
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel (degreased) 60 to 120
Aluminum 10 to 30
Zinc dichromate 50 to 150
Neoprene <20
Rubber, nitrile <20
ABS 20 to 50
PVC 50 to 100
Polycarbonate 30 to 90
Phenolic 20 to 60
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative humidity.
The following graph shows the tensile strength developed with
time on Buna N rubber at different levels of humidity.
% Full Cured Strength @ 22 °C
Time, seconds
100
75
50
25
0
0 10 20 30 40 50 60
60% RH
40% RH
20% RH
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2,, K
-1
80×10
-6
Coefficient of Thermal Conductivity ISO 8302,
W/(m·K)
0.1
Glass Transition Temperature, ISO 11359-2,
°C
150
Electrical Properties:
Volume Resistivity, IEC 60093, Ω·cm 10×10
15
Surface Resistivity, IEC 60093, Ω 10×10
15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
25
Dielectric Constant / Dissipation Factor, IEC 60250:
0.1-kHz 2.65 / <0.02
1-kHz 2.75 / <0.02
10-kHz 2.75 / <0.02
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties