Datasheet
PolySwitch Resettable Devices – Telecommunications & Networking Devices
RoHS Compliant, ELV Compliant
259
11
Terminal Material Tin-plated Brass, Nickel Under-plating
Soldering Characteristics EIC 60008-2-58
Test Conditions
Passive Aging 60°C, 1000 hrs
85°C, 1000 hrs
Humidity Aging 85°C, 85% RH, 500 hrs
Thermal Shock 125°C, -55°C (10 Times)
Solvent Resistance MIL-STD-202, Method 215F
Note: Storage conditions: 40°C (max), 70% RH (max), devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
TS250/TSV250/TSL250*
Physical Characteristics
Environmental Specifications
* 250V
AC
interrupt products may help equipment pass ITU K.20, K.21 and K.45 recommendations and Telcordia GR-1089 Port Type 2 and 4 requirements.
† 600V
AC
interrupt products may help equipment pass UL60950, TIA-968-A and GR1089 Port Type 1, 3 and 5 requirements.
‡
Excluding TRF600-150 and TRF600-400, which have a coating that is not rated for dielectric withstand and can withstand 500h at 85°C/85% RH or 1000h at 60°C/90% RH.
Lead Material Tin-plated Copper, 22AWG
Insulating Material Cured Epoxy Polymer
‡
Flammability Per IEC 695-2-2 Needle Flame Test for 20s
Soldering Characteristics ANSI/J-STD-002, Category 3
Solder Heat Withstand IEC-STD 68-2-20, Test Tb, Section 5 Method 1A, Condition B: Can Withstand 10 s at 260°C±5°C
Note:
Devices are not intended to be placed through a reflow process.
TRF600†
Physical Characteristics
Test Conditions
Passive Aging 60°C, 1000 hrs
85°C, 1000 hrs
Humidity Aging 85°C, 85% RH, 1000 hrs
‡
Thermal Shock 125°C, -55°C (10 Times)
Solvent Resistance MIL-STD-202, Method 215F
Note: Storage conditions: 40°C (max), 70% RH (max) devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
Environmental Specifications
Operating temperature range for all listed products is -40°C to 85°C, except for TRF250-080T and TRF250-184 (0°C to 85°C)
Table T5
Physical Characteristics and Environmental Specifications for
PolySwitch Telecommunications and Networking Devices
Cont’d
Lead Material Tin-plated Copper, 22AWG
Insulating Material Cured Epoxy Polymer
Flammability Per IEC 695-2-2 Needle Flame Test for 20 s
Soldering Characteristics ANSI/J-STD-002, Category 3
Solder Heat Withstand IEC-STD 68-2-20, Test Tb, Section 5 Method 1A, Condition B: Can Withstand 10s at 260°C±5°C
Note: Devices are not intended to be placed through a reflow process.
Test Conditions
Passive Aging 60°C, 1000 hrs
85°C, 1000 hrs
Humidity Aging 85°C, 85% RH, 1000 hrs
Thermal Shock 125°C, -55°C (10 Times)
Solvent Resistance MIL-STD-202, Method 215F
Note: Storage conditions: 40°C (max), 70% RH (max), devices should remain in original sealed bag prior to use. Devices may not meet specified values if these storage conditions are exceeded.
TRF250*
Physical Characteristics
Environmental Specifications
2013_CP_S11-Poly-8-TeleNetwork.indd 259 8/3/13 10:41 AM