Datasheet

26
Transient Voltage Suppression Diodes
Revision: January 09, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Surface Mount – 600W > SMBJ series
SMBJ Series
Please refer to http://www.Littelfuse.com/series/SMBJ.html for current information.
Physical Specifications
Weight
0.003 ounce, 0.093 grams
Case
JEDEC DO214AA. Molded plastic body
over glass passivated junction
Polarity
Color band denotes cathode except
Bidirectional
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102D
Environmental Specifications
Temperature Cycle JESD22-A104
Pressure Cooker JESD 22-A102
High Temp. Storage JESD22-A103
HTRB JESD22-A108
Thermal Shock JESD22-A106
Soldering Parameters
Temperature (T)
Time (t)
T
s(min)
T
s(max)
T
L
T
P
t
s
Preheat
t
L
t
p
Ramp-up Critical Zone
T
L
to T
P
Ramp-down
t 25˚C to Peak
25˚C
Reflow Condition -FBEoGSFFBTTFNCMZ
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) oTFDT
Average ramp up rate (Liquidus Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Time (min to max) (t
s
) oTFDPOET
Peak Temperature (T
P
) 260
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
oTFDPOET
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 280°C