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PolySwitch Resettable Devices – Surface-mount Devices

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• Smaller size saves board space and cost

• Many product choices give engineers more design

flexibility

• Compatible with high-volume electronics assembly

• Assists in meeting regulatory requirements

• Higher voltage ratings allow use in new applications

• RoHS compliant

• Halogen free

(refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm)

• Broadest range of resettable devices available in the

industry

• Current ratings from 0.05 to 3A

• Voltage ratings from 6V computer and electronic

applications to 60V telecom applications

• Agency recognition: UL, CSA, TÜV

• Small footprint

• Fast time-to-trip

• Low resistance

• Computer

• Portable electronics

• Multimedia

Benefits Features

Applications

• Game machines

• Telephony and broadband

• Mobile phones

• Automotive

• Industrial controls

• Battery

PolySwitch surface-mount devices are the preferred

circuit protection method for computer, consumer,

multimedia, portable, and automotive electronics

applications.

In an affort to reduce the size and cost of surface-mount

devices, we introduced the miniSMD product series in

1995. Subsequently, we developed the microSMD,

nanoSMD, picoSMD and femtoSMD family of products.

The femtoSMD series reduced the device size to a

1608mm (0603 mils) footprint, one twelfth the size of

the popular miniSMD series.

Recent additions to the PolySwitch surface-mount series

include 0.5A picoSMD 1210mm (0805 mils) and 0.35A

femtoSMD 1608mm (0603 mils) devices.

PolySwitch Resettable Devices

Surface-mount Devices

Summary of content (20 pages)

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PolySwitch Resettable Devices – Surface-mount Devices PolySwitch Resettable Devices Surface-mount Devices PolySwitch surface-mount devices are the preferred circuit protection method for computer, consumer, multimedia, portable, and automotive electronics applications. In an affort to reduce the size and cost of surface-mount devices, we introduced the miniSMD product series in 1995. Subsequently, we developed the microSMD, nanoSMD, picoSMD and femtoSMD family of products.
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Application Selection Table for Surface-mount Devices • The table below lists PolySwitch surface-mount devices typically used in these applications. • Specifications for the suggested PolySwitch surface-mount device part numbers can be found in this section. • Once a part has been selected, the user should evaluate and test each product for the intended application.
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Size mm (mils) PolySwitch Resettable Devices – Surface-mount Devices Table S1 Product Series: Size, Current Rating, Voltage Rating/Maximum Resistance for Surface-mount Devices femtoSMD picoSMD nanoSMD microSMD miniSMD midSMD SMD SMD2 miniSMDE decaSMD 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210) 4532 (1812) 5050 (2018) 7555 (2920) 8763 (3425) 11550 (4420) 5050 (2018) Hold Current (A) 0.050 15VDC/30.00Ω — — 30VDC/50Ω — — — — — 0.080 12VDC/14.
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Table S2 Thermal Derating for Surface-mount Devices [Hold Current (A) at Ambient Temperature (°C)] Maximum Ambient Temperature Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C 125°C femtoSMDC Series Size 1608 mm/0603 mils NEW femtoSMDC005F 0.08 0.07 0.06 0.05 0.05 0.04 0.04 0.03 0.03 0.02 0.02 — NEW femtoSMDC008F 0.13 0.11 0.10 0.08 0.08 0.07 0.06 0.06 0.05 0.04 0.04 — NEW femtoSMDC010F 0.16 0.14 0.12 0.11 0.10 0.09 0.08 0.07 0.06 0.
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Thermal Derating for Surface-mount Devices [Hold Current (A) at Ambient Temperature (°C)] PolySwitch Resettable Devices – Surface-mount Devices Table S2 Cont’d Maximum Ambient Temperature Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C 125°C miniSMDC Series Size 4532 mm/1812 mils miniSMDC110F 1.60 1.45 1.28 1.10 1.07 0.92 0.83 0.71 0.66 0.57 0.52 — miniSMDC110F/16 1.68 1.49 1.30 1.10 1.05 0.92 0.83 0.75 0.64 0.55 0.50 — miniSMDC110F/24 2.00 1.
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Figure S1 Thermal Derating Curve for Surface-mount Devices A = femtoSMD / picoSMD / nanoSMD / microSMD / miniSMD / decaSMD and SMD Figure S1 200 180 miniSMDE190F C = SMDH120 and SMDH160 % of rated hold and trip current B B = 160 140 A C 120 100 80 60 A 40 C B 20 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (˚C) Table S3 Electrical Characteristics for Surface-mount Devices at Room Temperature Part Number IH (A) IT (A) VMAX (VDC) IMAX (A) PD MAX (W) Max.
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IH (A) IT (A) VMAX (VDC) IMAX (A) PD MAX (W) microSMD005F 0.05 0.15 30 10 1.00 0.25 microSMD010F 0.10 0.25 30 10 0.80 0.50 microSMD035F 0.35 0.75 6 40 0.80 8.00 microSMD050F 0.50 1.00 13.2 40 0.80 microSMD075F 0.75 1.50 6 40 0.80 microSMD110F 1.10 2.20 6 40 microSMD150F 1.50 3.00 6 Part Number Cont’d RMIN (Ω) R1MAX (Ω) Figure for Dimensions 1.50 3.60 50.00 S2 1.00 2.10 15.00 S2 0.20 0.32 1.30 S2 8.00 0.05 0.25 0.90 S2 8.00 0.10 0.11 0.
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Table S3 Electrical Characteristics for Surface-mount Devices at Room Temperature IH (A) Part Number IT (A) VMAX (VDC) IMAX (A) PD MAX (W) Max. Time-to-Trip (A) (S) Cont’d RMIN (Ω) R1MAX (Ω) Figure for Dimensions SMD Series Size 7555 mm/2920 mils SMD030F 0.30 0.60 60 10 1.70 1.50 3.00 1.200 4.800 S4 SMD050F 0.50 1.00 60 10 1.70 2.50 4.00 0.350 1.400 S4 SMD075F 0.75 1.50 30 40 1.70 8.00 0.30 0.350 1.000 S4 SMD075F/60 0.75 1.50 60 10 1.70 8.00 0.30 0.350 1.
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A Part Number Min. B Max. C Min. Max. 0.60 1.00 D Min. Max. 1.30 1.50 E Min. Max. 0.25 0.75 Min. Cont’d F Max. Min. G Max. Min. Max. H Min. Figure picoSMDC Series Size 2012 mm/0805 mils NEW picoSMDC010S 2.00 2.20 (0.079) (0.087) NEW picoSMDC012S 2.00 2.20 (0.079) (0.087) picoSMDC020S 2.00 2.20 (0.079) (0.087) picoSMDC035S 2.00 2.20 (0.079) (0.087) NEW picoSMDC050S 2.00 2.20 (0.079) (0.087) coming soon picoSMDC075S* 2.00 2.20 (0.079) (0.
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Table S4 Dimensions for Surface-mount Devices in Millimeters (Inches) A Part Number Min. B Max. C Min. Max. 0.635 0.89 D Min. Max. 3.07 3.41 E Min. Max. 0.25 0.95 Min. Cont’d F Max. Min. G Max. Min. Max. H Min. Figure miniSMDC Series Size 4532 mm/1812 mils miniSMDC010F 4.37 4.73 (0.172) (0.186) miniSMDC014F 4.37 4.73 (0.172) (0.186) miniSMDC020F 4.37 4.73 (0.172) (0.186) miniSMDC030F 4.37 4.73 (0.172) (0.186) miniSMDC050F 4.37 4.73 (0.172) (0.186) miniSMDC075F 4.
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A Part Number Min. B Max. Min. C Max. D Min. Max. 4.22 4.93 E Min. Max. 0.25 0.36 Cont’d F Min. Max. 0.25 0.36 G Min. Max. 0.30 0.46 Min. Max. H Min. Figure midSMD Series Size 5050 mm/2018 mils SMD030F-2018 4.72 5.44 (0.186) (0.214) decaSMDC050F/60 4.70 5.31 (0.185) (0.209) SMD100F-2018 4.72 5.44 (0.186) (0.214) SMD150F-2018 4.72 5.44 (0.186) (0.214) SMD200F-2018 4.72 5.44 (0.186) (0.214) — 1.78 — (0.070) 0.63 0.89 (0.025) (0.035) — 1.52 — (0.
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Figure S5-S12 Typical Time-to-trip Curves at 20°C for Surface-mount Devices Figure S5 A 100 BC D E G F 10 Time-to-trip (s) femtoSMDCxxxF A = femtoSMDC005F B = femtoSMDC008F C = femtoSMDC010F D = femtoSMDC012F E = femtoSMDC016F F = femtoSMDC020F G = femtoSMDC035F 1 0.1 0.01 E A 0.001 0.01 0.
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Cont’d Figure S8 microSMDxxxF A = microSMD005F B = microSMD010F C = microSMD035F D = microSMD050F E = microSMD075F F = microSMD110F G = microSMD150F H = microSMD175F I = microSMD200F 100 C 10 I GH E Time-to-trip (s) A B F D 1 0.1 I G E C 0.01 H D A 0.001 0.
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Figure S5-S12 Typical Time-to-trip Curves at 20°C for Surface-mount Devices Figure S10 100 A D B E C 10 Time-to-trip (s) midSMD A = SMD030F-2018 B = decaSMDC050F/60 C = SMD100F-2018 D = SMD150F-2018 E = SMD200F-2018 Cont’d 1 0.1 B 0.01 0.1 D C E A 10 1 100 Fault Current (A) Figure S11 H 100 F BC G DE A 10 Time-to-trip (s) SMDxxxF A = SMD030F B = SMD050F C = SMD075F, SMD075F/60 D = SMD100F, SMD100F/33 E = SMDH120 F = SMD125F G = SMD260F H = SMD300F, SMD300F/15 1 H 0.
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Operating temperature range -40°C to 85°C, -40°C to 125°C for SMDH120 and SMDH160 Physical Characteristics Terminal pad material Soldering characteristics 100% matte tin with nickel underplate ANSI/J-STD-002 Category 3 for femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series ANSI/J-STD-002 Category 1 for SMD series Solder heat withstand per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A Flammability resistance per IEC 695-2-2 Needle Flame Test for 20 sec. Recommended storage conditions 40°C max, 70% R.
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Table S6 Packaging and Marking Information for Surface-mount Devices Cont’d Recommended Pad Layout Figures [mm(In.)] Tape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition microSMD005F 4,000 20,000 05 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV microSMD010F 4,000 20,000 10 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV microSMD035F 4,000 20,000 3 2.50 (0.098) 1.00 (0.039) 2.00 (0.
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PolySwitch Resettable Devices – Surface-mount Devices Table S6 Packaging and Marking Information for Surface-mount Devices Cont’d Recommended Pad Layout Figures [mm(In.)] Tape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition SMD030F 2,000 10,000 030F 3.10 (0.12) 2.30 (0.09) 5.10 (0.201) UL, CSA, TÜV SMD050F 2,000 10,000 050F 3.10 (0.12) 2.30 (0.09) 5.10 (0.201) UL, CSA, TÜV SMD075F 2,000 10,000 075F 3.
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Solder Reflow and Rework Recommendation for Surface-mount Devices Classification Reflow Profiles Pb-Free Assembly 3°C/second max. Figure S14 tp Critical Zone TL to Tp Tp Ramp up 150°C 200°C 60-120 seconds TL Temperature Profile Feature Average ramp up rate (TsMAX to Tp) Preheat • Temperature min. (TsMIN) • Temperature max.
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femtoSMDC005F femtoSMDC008F femtoSMDC010F femtoSMDC035F femtoSMDC012F femtoSMDC016F femtoSMDC020F picoSMDC010S picoSMDC050S picoSMDC075S picoSMDC110S picoSMDC012S picoSMDC020S picoSMDC035S All nanoSMDC series except nanoSMDC012F nanoSMDC016F nanoSMDC200F nanoSMDC012F nanoSMDC016F nanoSMDC200F 1.95 ± 0.1 A0 1.00 ± 0.1 1.00 ± 0.1 1.55 ± 0.1 1.60 ± 0.1 1.95 ± 0.1 B0 1.85 ± 0.1 1.85 ± 0.1 2.50 ± 0.1 2.45 ± 0.1 3.50 +0.1/-0.08 3.5 ± 0.1 K0 0.90 ± 0.1 0.80 ± 0.1 0.86 ± 0.1 1.35 ± 0.1 0.
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Part Numbering System for Surface-mount Devices SMD 150 F /33 -RB -2 Packaging 2 = Tape and Reel Rx = Resistance Range (Limited part number availability) Alternative Voltage Rating (If applicable) Lead Free Hold Current Indicator Product Series 12 Warning : • Users should independently evaluate the suitability of and test each product selected for their own application. • Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.