Datasheet

47
Revised: July 12, 2010
POLYFUSE
®
Resettable PTCs
© 2010 Littelfuse, Inc
2016L Series
Surface Mount > 2016L Series
2016L Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/2016L.html for current information.
Environmental Specifications
Soldering Parameters
Condition Reflow
Peak Temp/ Duration Time 260°C / 10 Sec
Time above liquids (TAL) 220°C 60 Sec ~ 100 Sec
Preheat 120°C~ 180°C 50 Sec ~ 150 Sec
Storage Condition 0°C~35°C,

=
70%RH
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oven, N
2
environment for lead–free
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solvents.
Note: If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped
State
125°C
Passive Aging
+85°C, 1000 hours
-/+5% typical resistance change
Humidity Aging
+85°C, 85%,R.H.,1000 hours
-/+5% typical resistance change
Thermal Shock
MIL–STD–202, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance
MIL–STD–202, Method 215
No change
Vibration
MIL–STD–883C, Method 2007.1,
Condition A
No change
Moisture Sensitivity Level Level 1, J–STD–020C
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/
J-STD-002 Category 3.
Preheating
120
180
220
260
0
60 to 100
Temperature (°C)
Soldering Cooling
120
50 to 150
Time(s)