Datasheet

LITE-ON TECHNOLOGY CORPORATION
Property of LITE-ON Only
TEMPERATURE PROFILE OF SOLDERING REFLOW
(1) IR Reflow soldering (JEDEC-STD-020C compliant)
One time soldering reflow is recommended within the condition of temperature and time
profile shown below.
Profile item
Conditions
Preheat
- Temperature Min (T
Smin
)
- Temperature Max (T
Smax
)
- Time (min to max) (ts)
150˚C
200˚C
90±30 sec
Soldering zone
- Temperature (T
L
)
- Time (t
L
)
217˚C
60 sec
Peak Temperature (T
P
)
260˚C
Ramp-up rate
3˚C /sec max.
Ramp-down rate
3~6˚C / sec
60 ~ 120 sec
25 C
150 C
200 C
260 C
217 C
60 sec
Tim e (sec)
Tem perature ( C)
20 sec
Tsm ax
ts (Preheat)
tL (Soldering)
Tsm in
TL
TP
Ram p-down
Ram p-up
35~70 sec
-
Part No. :
LTV-817 (M, S, S-TA, S-TA1, S-TP) Series (Rev.-, September 25, 2013)
Page :
13
of
16
BNS-OD-C131/A4