Datasheet

15/18
Part No : LTV-814 824 844 (M, S,
S-TA, S-TA1, S-TP) Series
BNC-OD-C131/A4
6. TEMPERATURE PROFILE OF SOLDERING
6.1 IR Reflow soldering (JEDEC-STD-020C compliant)
One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times.
Profile item
Conditions
Preheat
- Temperature Min (T
Smin
)
- Temperature Max (T
Smax
)
- Time (min to max) (ts)
150˚C
200˚C
90±30 sec
Soldering zone
- Temperature (T
L
)
- Time (t
L
)
217˚C
60 sec
Peak Temperature (T
P
)
260˚C
Ramp-up rate
3˚C / sec max.
Ramp-down rate
3~6˚C / sec
60 ~ 120 sec
25 C
150 C
200 C
260 C
217 C
60 sec
Tim e (sec)
Tem perature ( C )
20 sec
Tsm ax
ts (Preheat)
tL (Soldering)
Tsm in
TL
TP
Ram p-down
Ram p-up
35~70 sec