Datasheet

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Part No. : LTV-0601
BNS-OD-FC002/A4
9. TEMPERATURE PROFILE OF SOLDERING
9.1 IR Reflow soldering (JEDEC-STD-020C compliant)
One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three
times.
Profile item
Conditions
Preheat
- Temperature Min (T
Smin
)
- Temperature Max (T
Smax
)
- Time (min to max) (ts)
150˚C
200˚C
90±30 sec
Soldering zone
- Temperature (T
L
)
- Time (t
L
)
217˚C
60 ~ 100 sec
Peak Temperature (T
P
)
260˚C
Ramp-up rate
3˚C / sec max.
Ramp-down rate
3~6˚C / sec
60 ~ 120 sec
25 C
150 C
200 C
260 C
217 C
60-100 sec
Time (sec)
Temperature ( C)
20 sec
Tsmax
ts (Preheat)
tL (Soldering)
Tsmin
TL
TP
Ramp-down
Ramp-up