Datasheet

LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Part No.: LTPL-P00DWS57 Page: 8 of 13
BNC-OD-C131/A4
5. Reflow Soldering Characteristics
Time
Temperature
t
P
Preheat, t
S
t
L
T
Smin
T
Smax
25
°
C to Peak, t
T
L
Ramp-dow n
Ramp-up
T
P
Profile Feature Lead Free Assembly
Average Ramp-Up Rate (T
Smax
to T
P
) 3°C / second max
Preheat Temperature Min (T
Smin
) 150°C
Preheat Temperature Max (T
Smax
) 200°C
Preheat Time (t
Smin
to t
Smax
) 60 – 180 seconds
Time Maintained Above Temperature (T
L
) 217°C
Time Maintained Above Time (t
L
) 60 – 150 seconds
Peak / Classification Temperature (T
P
) 260°C
Time Within 5°C of Actual Peak Temperature (t
P
) 5 seconds
Ramp – Down Rate 6°C / second max
Time 25°C to Peak Temperature 8 minutes max
Notes:
1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended
hand soldering condition is 350°C max. and 2secs ma x. for one time only.
2. All temperatures refer to topside of the package, measured on the package body surface.
3. The soldering condition referring to J-STD-020B. If the LEDs were unpacked more than 72hrs, we
recommend baking the LEDs at 60℃ at least 12 hours before soldering process.
4. The soldering profile could be further referred to different soldering grease material characteristic. The
grease vendor will provide this information.
5. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.
6. Although the recommended reflow conditions are specified above, the reflow or hand soldering
condition at the lowest possible temperature is desirable for the LEDs.
7. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip
soldering method