Datasheet

Figure 20. Evaluation soldering profiles (polyled).
Process Zone Symbol DT Maximum DT/Dtime
Heat Up P1, R1 25°C to 160°C4°C/s
Solder Paste Dry P2, R2 160°C to 200°C 0.5°C/s
Solder Reflow P3, R3 200°C to 255°C (260°C at 10 seconds max) 4°C/s
P3, R4 255°C to 200°C-6°C/s
Cool Down P4, R5 200°C to 25°C-6°C/s
0
t-TIME (SECONDS)
T – TEMPERATURE – (°C)
230
200
160
120
80
50 150100 200 250 300
180
220
255
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R3 R4
R5
60 sec.
MAX.
ABOVE
220°C
MAX. 260°C
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Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.