Datasheet

11
HSDL-44xx Absolute Maximum Ratings
Parameter Symbol Min. Max. Unit Ref.
Peak Forward Current (Duty Factor = 20%, I
FPK
500 mA Fig. 7, 8
Pulse Width = 100 µs)
DC Forward Current I
FDC
100 mA Fig. 6
Power Dissipation P
DISS
100 mW
Reverse Voltage (I
R
= 100 µA) V
R
5V
Transient Forward Current (10 µs Pulse) I
FTR
1.0 A [1]
Operating Temperature T
O
-40 85 °C
Storage Temperature T
S
-55 100 °C
Junction Temperature T
J
110 °C
Lead Solder Temperature 260/5 s °C
[1.6 mm (0.063 in.) from body]
Reflow Soldering Temperatures
Convection IR 235/90 s °C Fig. 20
Vapor Phase 215/180 s °C
Note:
1. The transient peak current in the maximum nonrecurring peak current the device can withstand without damaging the LED die and the wire bonds.
HSDL-44xx Electrical Characteristics at T
A
= 25°C
Parameter Symbol Min. Typ. Max. Unit Condition Ref.
Forward Voltage V
F
1.30 1.50 1.70 V I
FDC
= 50 mA Fig. 2
2.15 I
FPK
= 250 mA
Forward Voltage ∆V
F
/∆T -2.1 mV/°CI
FDC
= 50 mA Fig. 3
Temperature Coefficient -2.1 I
FDC
= 100 mA
Series Resistance R
S
2 Ω I
FDC
= 100 mA
Diode Capacitance C
O
50 pF 0 V, 1 MHz
Reverse Voltage V
R
520 V I
R
= 100 µA
Thermal Resistance, Rq
jp
170 °C/W
Junction to Pin