Datasheet
12
Recommended Metal Solder
Stencil Aperture
It is recommended that only a 0.127
mm (0.005 inches) or a 0.11 mm (0.004
inches) thick stencil be used for solder
paste printing. This is to ensure
adequate printed solder paste volume
and no shorting. See the table below
the drawing for combinations of metal
stencil aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad is 2.7
mm x 1.25 mm as per land pattern.
Aperture Size (mm)
Stencil Thickness, t (mm) length, l width, w
0.127 mm 1.75 ± 0.05 0.55 ± 0.05
0.11 mm 2.4 ± 0.05 0.55 ± 0.05
Appendix A: HSDL-3201#021
SMT Assembly Application Note
METAL STENCIL
FOR SOLDER PASTE
PRINTING
LAND
PATTERN
PCB
STENCIL
APERTURE
SOLDER
MASK
APERTURES AS PER
LAND DIMENSIONS
l
w
t
Solder Pad, Mask, and Metal Stencil