Datasheet
11
Moisture Proof Packaging
The HDSL-3201 is shipped in moisture
proof packaging. Once opened,
moisture absorption begins.
This part is compliant to JEDEC Level
4.
Recommended Storage
Conditions
Storage 10°C to 30°C
Temperature
Relative below 60% RH
Humidity
Time from Unsealing to
Soldering
After removal from the bag, the parts
should be soldered within three days
if stored at the recommended storage
conditions.
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage to
the parts.
Package Temp. Time
In reels 60°C ≥ 48 hours
100°C ≥ 4 hours
In bulk 125°C ≥ 2 hours
150°C ≥ 1 hour
Baking should only be done once.
Recommended Land Pattern for HSDL-3201#021
(Front Options)
0.60
1.25
1.75
1.35
0.10
0.475
1.425
2.375
3.325
C
L
MOUNTING
CENTER
SHIELD
SOLDER PAD
FIDUCIAL
2.05
0.775
UNIT: mm
Recommended Land Pattern for HSDL-3201#008
(Top Options)
0.60
0.9
2.20
3.625
MOUNTING CENTER
0.575
1.60
PITCH 7 x 0.95
1.275
1.45
3.
7