HSDL-3201 IrDA® Data 1.4 Low Power Compliant 115.2 kb/s Infrared Transceiver Data Sheet Features • Complete shutdown – TxD, RxD, PIN diode • One optional external component • Temperature range: -25°C to 85°C • 32 mA LED drive current • Integrated EMI shield • IEC825-1 Class 1 eye safe • Edge detection input – Prevents the LED from long turn on time • • • • • Ultra small surface mount package Minimal height: 2.5 mm VCC from 2.7 to 3.
Application Circuit Applications VLED TXD RXD SHUT DOWN The HSDL-3201 meets the 20 cm link distance to other IrDA 1.4 low power devices, and a 30 cm link distance to IrDA 1.4 standard devices. 7 TXD LED CURRENT SOURCE 6 RXD 5 SD 4 AGND Description The HSDL-3201 is one of a new generation of low-cost Infrared (IR) transceiver modules from Avago Technologies. It features the smallest footprint in the industry at 2.5 H x 8.0 W x 3.0 D mm. Although the supply voltage can range from 2.7 V to 3.
Recommended Application Circuit Components Shutdown Mode Notes Component C1 When the HSDL-3201 is in Shutdown Mode (SD pin high), the part presents different impedances to the rest of the circuit than when it is in normal mode. Recommended Value 1.0 μF Note 1 Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50°C/W.
Recommended Operating Conditions Parameter Symbol Operating Temperature TA Supply Voltage VCC LED Supply Voltage VLED TXD, SD Input Logic High VIH Voltage Logic Low VIL Receiver Input Logic High EIH Irradiance Logic Low EIL Receiver Data Rate Min. -25 2.7 2.7 VCC-0.5 2/3 VCC 0 0.0081 2.4 9.6 tpw Conditions V V V V mW/cm2 μW/cm2 kb/s For in-band signals. For in-band signals.
Electrical & Optical Specifications Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values are at 25°C and 3.0 V unless otherwise noted.
Notes: 1. C1 must be placed within 0.7 cm of the HSDL-3201 to obtain optimum noise immunity. 2. If TXD is stuck in the high state, the LED will turn off after about 20 μs. 3. RXD will echo the TXD signal while TXD is transmitting data. 4. In-Band IrDA signals and data rates ≤ 115.2 Kb/s. 5. RXD Logic Low is a pulsed response. The pulse width is 2.4 μs, independent of data rate. 6. RXD Logic High during shutdown is a weak pullup resistor (300 kΩ). 7.
HSDL-3201#021 Package Dimensions MOUNTING CENTER 4.0 1.025 CL 2.05 RECEIVER EMITTER 2.2 2.5 1.175 0.35 0.65 0.80 1.05 1.25 2.85 2.55 4.0 8.0 3.0 2.9 1.85 PIN1 CL UNIT: mm TOLERANCE: ± 0.2 mm COPLANARITY = 0.1 mm MAX. PIN 1 0.6 3.325 6.
HSDL-3201#021 Tape and Reel Dimensions UNIT: mm 4.0 ± 0.1 1.75 ± 0.1 + 0.1 ∅ 1.5 0 1.5 ± 0.1 POLARITY PIN 8: VLED 7.5 ± 0.1 8.4 ± 0.1 16.0 ± 0.2 PIN 1: GND 0.4 ± 0.05 2.8 ± 0.1 EMPTY 3.4 ± 0.1 8.0 ± 0.1 PROGRESSIVE DIRECTION PARTS MOUNTED LEADER (400 mm MIN.) (40 mm MIN.) EMPTY (40 mm MIN.) OPTION # "B" "C" QUANTITY 001 178 60 500 021 330 80 2500 UNIT: mm DETAIL A 2.0 ± 0.5 B C 16.4 +2 0 ∅ 13.0 ± 0.5 R 1.0 LABEL 21 ± 0.8 DETAIL A 2.0 ± 0.
HSDL-3201#008 Package Dimensions +0.05 2.8 -0.2 3.6 2 1.55 1.55 +0.05 1.8 -0.2 2 CL CL PIN1 2.8 3.35 0.4 ± 0.15 2.35 5.1 0.7 ± 0.1 0 ± 0.1 (MAX) 7.5 0.3 PIN1 Pin 1 2 3 4 5 6 7 8 9 9 Symbol GND NC VCC AGND SD RxD TxD VLED EMI Shield Description Ground No Connection Supply Voltage Analog Ground Shutdown (Active High) Receive Data Transmit Data LED Voltage EMI Shield 0.95 ± 0.1 0.6 ± 0.15 0 ± 0.05 (MAX.) 3.325 0.95 x 7 = 6.65 ± 0.15 UNIT: mm TOLERANCE: ± 0.2 mm COPLANARITY = 0.
HSDL-3201#008 Tape and Reel Dimensions 60°TYP. ∅ 99.5 ± 1 120° 3 +0.5 ∅ 13.1 -0 ∅ 264 DETAIL A (5/1) PS ∅ 330 ± 1 1 2 Po D1 P2 Do +0.5 16.0 -0 B T E 2.6 F W A Bo 5° B-B SECTION 5°(MAX.) A P1 Ao 1.5 B Ko 5°(MAX.) 5° 3.1 ± 0.1 A-A SECTION UNIT: mm SYMBOL SPEC SYMBOL SPEC Ao Bo Ko Po P1 P2 T 3.65 ± 0.10 7.90 ± 0.10 +0.05 2.75 - 0.10 4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.10 0.40 ± 0.10 E F Do D1 W 10Po 1.75 ± 0.10 7.50 ± 0.10 1.55 ± 0.05 1.50 (MIN.) 16.00 ± 0.
Moisture Proof Packaging The HDSL-3201 is shipped in moisture proof packaging. Once opened, moisture absorption begins. Recommended Land Pattern for HSDL-3201#021 (Front Options) CL This part is compliant to JEDEC Level 4. 3. SHIELD SOLDER PAD 1.35 MOUNTING CENTER 1.25 Recommended Storage Conditions Storage Temperature Relative Humidity 2.05 0.10 10°C to 30°C 0.775 below 60% RH 1.75 FIDUCIAL Time from Unsealing to Soldering 0.60 0.
Appendix A: HSDL-3201#021 SMT Assembly Application Note Solder Pad, Mask, and Metal Stencil METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCB Recommended Metal Solder Stencil Aperture It is recommended that only a 0.127 mm (0.005 inches) or a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting.
Adjacent Land Keep-Out and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. 8.2 0.2 2.6 The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. It is recommended that two fiducial crosses be place at mid-length of the pads for unit alignment. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. 13 3.
PCB Layout Suggestion Component Side The following PCB layout shows a recommended layout that should result in good electrical and EMI performance. Things to note: 1. The ground plane should be continuous under the part, but should not extend under the shield trace. 2. The shield trace is a wide, low inductance trace back to the system ground. 3. The AGND pin is connected to the ground plane and not to the shield tab. Circuit Side 14 SHIELD VCC GROUND 5.
Recommended Solder Paste/Cream Volume for Castellation Joints Based on calculation and experi-ment, the printed solder paste volume required per castellation pad is 0.22 cubic mm (based on either no-clean or aqueous solder cream types with typically 60% to 65% solid content by volume). Using the recommended stencil results in this volume of solder paste.
Recommended Reflow Profile MAX. 260°C T – TEMPERATURE – (°C) 255 R3 230 220 200 R2 180 60 sec. MAX. ABOVE 220°C 160 R1 120 R4 R5 80 25 50 0 100 150 200 250 300 t-TIME (SECONDS) P1 HEAT UP Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down P2 SOLDER PASTE DRY Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5 The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process.
Window Design To insure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30 degrees, the maximum, to a cone angle of 60 degrees. Z Minimum and Maximum Window Sizes Dimensions are in mm. Depth (Z) 0 1 2 3 4 5 6 7 8 9 10 Y min. 1.70 2.23 2.77 3.31 3.84 4.38 4.91 5.45 5.99 6.52 7.
Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. Flat Window (First choice) If the window must be curved for mechanical design reasons, place a curve on the back side of the window that has the same radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will reduce the effects.
Test Methods Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (please refer to IEC 801-3, severity level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port.
For company and product information, please go to our web site: WWW.liteon.com or http://optodatabook.liteon.com/databook/databook.aspx Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.
