Datasheet

12
Recommended Metal
Solder Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure adequate
printed solder paste volume and no
shorting. See the table below the
drawing for combinations of metal
stencil aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad is
2.7 mm x 1.25 mm as per land
pattern.
Stencil Thickness, t (mm)
Aperture Size(mm)
length, l width, w
0.152 mm 2.60 ± 0.05 0.55 ± 0.05
0.127 mm 3.00 ± 0.05 0.55 ± 0.05
Appendix A: HSDL-3201#011/001/021
SMT Assembly Application Note
METAL STENCIL
FOR SOLDER PASTE
PRINTING
LAND
PATTERN
PCB
STENCIL
APERTURE
SOLDER
MASK
APERTURES AS PER
LAND DIMENSIONS
l
w
t
Solder Pad, Mask, and
Metal Stencil