Datasheet

11
Moisture Proof Packaging
The HDSL-3201 is shipped in
moisture proof packaging. Once
opened, moisture absorption
begins.
Recommended Storage
Conditions
Storage 10°C to 30°C
Temperature
Relative
Humidity below 60% RH
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the
recommended storage conditions.
If times longer than two days are
needed, the parts must be stored
in a dry box.
Baking
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package Temp. Time
In reels 60°C ≥ 48 hours
100°C ≥ 4 hours
In bulk 125°C ≥ 2 hours
150°C ≥ 1 hour
Baking should only be done once.
Recommended Land Pattern for HSDL-3201#011/001/
021 (Front Options)
0.60
1.25
1.75
1.35
0.10
0.475
1.425
2.375
3.325
C
L
MOUNTING
CENTER
SHIELD
SOLDER PAD
FIDUCIAL
2.05
0.775
UNIT: mm
Recommended Land Pattern for HSDL-3201#008/018
(Top Options)
0.60
0.9
2.20
3.625
MOUNTING CENTER
0.575
1.60
PITCH 7 x 0.95
1.275
1.45