Data Sheet

LILY-W1 series - Data sheet
UBX-15000203 - R12 Product handling Page 36 of 42
C1-Public
9.2 Moisture sensitivity levels
LILY-W1 series modules are rated as MSL Level 4 devices in accordance with the IPC/JEDEC
J-STD-020 standard. For detailed information, see the moisture sensitive warning label on the
MBB (Moisture Barrier Bag).
After opening the dry pack, the modules must be mounted within 168 hours in factory conditions of
maximum 30 °C/60%RH or must be stored at less than 10%RH. The modules require baking if the
humidity indicator card shows more than 10% when read at 23±5 °C or if the conditions mentioned
above are not met. For information about the bake procedure, see also the J-STD-033B standard.
For more information regarding MSL (Moisture Sensitivity Level), labeling, and storage, see also the
Packaging information reference guide [1].
9.3 Reflow soldering
LILY-W131-00B and LILY-W132-00B are approved for one-time reflow processes only.
LILY-W131-10B. LILY-W132-10B and LILY-W133-10B are approved for two-time reflow processes.
Reflow soldering profiles must be selected in accordance with u-blox soldering recommendations
described in the system integration manual [2]. Failure to observe these recommendations can
result in severe damage to the product.
9.4 ESD precautions
LILY-W1 series modules are Electrostatic Sensitive Devices that demand the observance of
special handling precautions against static damage. Failure to observe these precautions can
result in severe damage to the product.
Proper ESD handling and packaging procedures must be applied throughout the processing, handling,
and operation of any application that incorporates the LILY-W1 series module. ESD precautions
should be implemented on the application board where the module is mounted.
For further information about the handling of LILY-W1 series modules, see also the LILY-W1 system
integration manual [2].