Data Sheet

3. Application Note:
3-1.Attention to the electrostatic protection, prevent the soldering iron and the equipment grounding bad;
And the workbench, working environment, packaging materials and from the human body Touch with
static electricity, etc., destroy IC and software be fly; Manual welding module solder iron temperature,
should pay attention to avoid the PCB copper stripping off;Soldering iron strictly Grounding
requirements, eliminating iron power failure module;
3-2.Attention to avoid the overall motherboard power supply circuit of bad welding connected to short
circuit or open circuit, causing the Bluetooth chip, abnormal voltage, The soft ware will fly and
problems of IC was damaged.
3-3.When programming firm ware, the VDDS supply voltage must in DC 2.4~3.3V, To avoid
programming has not completely, and abnormal status occur..
3-4. Use the module in the production and the transport process, please insure module’s component
protection, prevent the precision parts on the module Damaged (welding furnace exit and assembly,
testing, delivery process, suggest using collision buffer material, not collide with each other)
3-5. The module for the humidity sensitive components, if used in SMT reflow soldering operations,
please strictly follow the IPC/JEDECJ - STD – 020 regulation, completes the drying dehumidifying , and
for this module has second processing work after placed in the functional test environment, the humidity
of the chip is no guarantee that in a certain ratio, the honored guest please understand;(The attention note
show in below Fig.)
3-6. The diagram (show in below Fig.) of the module application on external filter parts, when need,
please design in the mainboard, the parts parameter can depend on the actual need to changes.