Reference Guide

HUM-A-900-PRO Trace Layout Guide
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4. Design Verification Test Procedures
After the design is fabricated the following measurements should be executed to verify the design:
1. Mechanical measurement of dimensions specified in the Microstrip Dimensions diagrams above
2. Obtain and review the detailed layer stackup solution used for the build from the PCB
manufacturer that specifies dielectric thicknesses and target dielectric constants for substrate
materials.
Note: Linx Applications Engineers are available to review Layout designs to ensure compliance and
optimal RF performance.
5. Production Test Procedures for Ensuring Compliance
During production test for the host device, The HUM-A-900-PRO module is to be activated in maximum
power transmit mode and the conducted RF output power at the RP-SMA connector is to be measured
using a Spectrum Analyzer, RF Power Meter or other appropriate RF measurement equipment. The
conducted output power should not exceed the output power specified in the HUM-A-900-PRO Data
Guide. If a conducted output power test is not possible on the host device, an equivalent radiated
output power test may be used.