Datasheet

LTM9012
27
9012f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
BGA Package
221-Lead (15mm × 11.25mm × 2.82mm)
(Reference LTC DWG # 05-08-1886 Rev Ø)
S R Q P N M L K J H G F E D C B A
12345613 12 11 10 9 8 7
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
DETAIL A
PACKAGE BOTTOM VIEW
3
SEE NOTES
PIN 1
BGA Package
221-Lead (15mm × 11.25mm × 2.82mm)
(Reference LTC DWG# 05-08-1886 Rev Ø)
BGA 221 0710 REV Ø
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95
4 3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE
DETAIL A
Øb (221 PLACES)
DETAIL B
SUBSTRATE
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
SYMBOL
A
A1 A2
b
b1
D
E
e F
G
H1 H2
aaa
bbb
ccc
ddd
eee
MIN
2.67 0.35 2.32 0.45 0.45 0.37 1.95
NOM
2.82 0.40 2.42 0.50 0.50 15.0
11.25
0.80
12.80
9.60 0.42 2.00
MAX
2.97 0.45 2.52 0.55 0.55 0.47 2.05 0.15 0.10 0.12 0.15 0.08
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 221
A2
D
E
e
e
b
F
G
SUGGESTED PCB LAYOUT
TOP VIEW
0.00 3.20 3.20 6.40 4.00 4.00 4.80 4.80 5.60 5.60 6.40 0.80 0.80 1.60 1.60 2.40 2.40
4.80
2.40
1.60
3.20
4.00
2.40
1.60
0.80
0.80
4.80
4.00
3.20
0.00
5.35 5.85
LTMXXXXXX
µModule
// bbb Z
Z
H2
H1
b
5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu OR Sn Pb EUTECTIC
0.50 ±0.025 Ø 221x
4.25
3.75
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.