Datasheet

LTM8055/LTM8055-1
2
Rev C
For more information www.analog.com
PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS
V
IN
, SV
IN
, V
OUT
, RUN, I
IN
, I
OUT
Voltage .....................40V
FB, SYNC, CTL, MODE Voltage ...................................6V
I
INMON
, I
OUTMON
Voltage .............................................6V
LL Voltage .................................................................15V
Maximum Junction Temperature (Notes 2, 3) ....... 125°C
Storage Temperature.............................. –55°C to 125°C
Peak Solder Reflow Body Temperature ................. 245°C
(Note 1)
BANK 2
V
OUT
A
IOUT LL
CLKOUT
RT FB SS
MODE SYNC
COMP
CTL
1
11
10
9
8
7
6
5
4
3
2
KJ LHGFEDCB
BGA PACKAGE
121-LEAD (15mm × 15mm × 4.92mm)
T
JMAX
= 125°C, θ
JA
= 20.5°C/W, θ
JCbottom
= 11.0°C/W, θ
JCtop
= 21.2°C/W, θ
JB
= 10.5°C/W,
WEIGHT = 2.8g, θ VALUES DETERMINED PER JEDEC JESD51-9, 51-12
BANK 1
GND
BANK 3
V
IN
TOP VIEW
SV
IN
I
IN
RUN
I
INMON
I
OUTMON
GND
ORDER INFORMATION
PART NUMBER TERMINAL FINISH PART MARKING* PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(SEE NOTE 2)
DEVICE FINISH CODE
LTM8055EY#PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 –40°C to 125°C
LTM8055IY#PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 –40°C to 125°C
LTM8055IY SnPb(63/37) LTM8055Y e0 BGA 3 –40°C to 125°C
LTM8055MPY#PBF SAC305 (RoHS) LTM8055Y e1 BGA 3 –55°C to 125°C
LTM8055MPY SnPb(63/37) LTM8055Y e0 BGA 3 –55°C to 125°C
LTM8055EY-1#PBF SAC305 (RoHS) LTM8055Y-1 e1 BGA 3 –40°C to 125°C
LTM8055IY-1#PBF SAC305 (RoHS) LTM8055Y-1 e1 BGA 3 –40°C to 125°C
• Device temperature grade is indicated by a label on the shipping
container.
• Pad or ball finish code is per IPC/JEDEC J-STD-609.
• BGA Package and Tray Drawings
This product is not recommended for second side reflow.
This product is moisture sensitive. For more information, go to
Recommended
BGA PCB Assembly and Manufacturing Procedures.
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