Datasheet

LTM8023
2
8023fj
For more information www.linear.com/LTM8023
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
V
IN
, RUN/SS Voltage ................................................. 40V
ADJ, R
T
, SHARE Voltage .............................................5V
V
OUT
, AUX .................................................................10V
PGOOD, SYNC...........................................................30V
BIAS
..........................................................................16V
(Note 1)
V
IN
+ BIAS ................................................................. 56V
Internal Operating Temperature
(Note 2)
.................................................. –40°C to 125°C
Storage Temperature.............................. –55°C to 125°C
Solder Temperature
............................................... 250°C
GND (BANK 3)
V
OUT
(BANK 2)
AUX
V
IN
(BANK 1)
R
T
HBA D
LGA PACKAGE
50-LEAD (11.25mm × 9mm × 2.82mm)
C
6
7
5
1
2
3
4
E F G
ADJ
BIAS
RUN/SS
SHARE
PGOOD
SYNC
GND (BANK 3)
V
OUT
(BANK 2)
AUX
V
IN
(BANK 1)
R
T
HBA D
BGA PACKAGE
50-LEAD (11.25mm × 9mm × 3.42mm)
C
6
7
5
1
2
3
4
E F G
ADJ
BIAS
RUN/SS
SHARE
PGOOD
SYNC
T
JMAX
= 125°C, θ
JA
= 30.4°C/W, θ
JCbottom
= 12.2°C/W,
θ
JCtop
= 23.9°C/W, θ
JB
= 12.1°C/W, WEIGHT = 0.9g
θ
VALUES DETERMINED PER JEDEC 51-9, 51-12
T
JMAX
= 125°C, θ
JA
= 32.1°C/W, θ
JCbottom
= 14.8°C/W,
θ
JCtop
= 23.7°C/W, θ
JB
= 14.6°C/W, WEIGHT = 0.9g
θ
VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION
PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
DEVICE FINISH CODE
LTM8023EV#PBF Au (RoHS) LTM8023V e4 LGA 3 –40°C to 85°C
LTM8023IV#PBF Au (RoHS) LTM8023V e4 LGA 3 –40°C to 85°C
LTM8023MPV#PBF Au (RoHS) LTM8023MPV e4 LGA 3 –55°C to 125°C
LTM8023EY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –40°C to 85°C
LTM8023IY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –40°C to 85°C
LTM8023IY SnPb (63/37)
LTM8023Y e0 BGA 3 –40°C to 85°C
LTM8023MPY#PBF SAC305 (RoHS) LTM8023Y e1 BGA 3 –55°C to 125°C
LTM8023MPY SnPb (63/37) LTM8023Y e0 BGA 3 –55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Terminal Finish Part Marking:
www.linear.com/leadfree
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
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