Datasheet

LTM8021
14
8021fc
PACKAGE DESCRIPTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 35
4
3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A
MARKED FEATURE
2.72 – 2.92
DETAIL A
PACKAGE SIDE VIEW
6.250
BSC
PACKAGE TOP VIEW
11.250
BSC
4
PAD 1
CORNER
X
Y
aaa Z
aaa Z
DETAIL A
SUBSTRATE
MOLD
CAP
0.27 – 0.37
2.40 – 2.60
bbb Z
Z
LTMXXXXXX
MModule
COMPONENT
PIN “A1”
PADS
SEE NOTES
1.270
BSC
0.605 – 0.665
0.605 – 0.665
8.890
BSC
5.080
BSC
PAD 1
C (0.30)
HBADC
5
1
3
2
3
4
EF
PACKAGE BOTTOM VIEW
G
4.445 4.445 3.175 3.175 1.905 0.0000 1.905 0.635 0.635
1.270
1.270
0.9525
1.5875
0.635
0.9525 0.3175
2.540
2.540
SUGGESTED PCB LAYOUT
TOP VIEW
0.0000
LGA Package
35-Lead (11.25mm × 6.25mm × 2.82mm)
(Reference LTC DWG # 05-08-1805 Rev A)