Datasheet

LTM8001
21
8001fb
For more information www.linear.com/LTM8001
APPLICATIONS INFORMATION
8001 F08
µMODULE DEVICE
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
JUNCTION A
t
CASE (BOTTOM)-TO-BOARD
RESISTANCE
Figure 8. Thermal Resistances Among μModule Device Printed Circuit Board and Ambient Environment