Datasheet

LTM4649
21
4649f
For more information www.linear.com/LTM4649
APPLICATIONS INFORMATION
Figure 16. Recommended PCB Layout
V
OUT
GND
C
OUT
C
IN
V
IN
4649 F16
GND
Layout Checklist/Example
The high integration of LTM4649 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con-
siderations are still necessary.
• Use large PCB copper areas for high current path,
including V
IN
, GND and V
OUT
. It helps to minimize the
PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capaci-
tors next to the V
IN
, GND and V
OUT
pins to minimize
high frequency noise.
• Place a dedicated power ground layer underneath the
unit.
• To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Do not put vias directly on the pads, unless they are
capped.
• Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
Figure 16 gives a good example of the recommended layout.