Datasheet

LTM4644/LTM4644-1
34
Rev. F
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BGA Package
77-Lead (9mm × 15mm × 5.01mm)
(Reference LTC DWG # 05-08-1900 Rev D)
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
BGA Package
77-Lead (15.00mm × 9.00mm × 5.01mm)
(Reference LTC DWG# 05-08-1900 Rev D)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS BALL DESIGNATION PER JESD MS-028 AND JEP95 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
4 3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE
DETAIL A
Øb (77 PLACES)
DETAIL B
SUBSTRATE
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
SYMBOL
A
A1 A2
b
b1
D
E
e F
G
H1 H2
aaa
bbb
ccc
ddd
eee
MIN
4.81 0.50 4.31 0.60 0.60 0.36 3.95
NOM
5.01 0.60 4.41 0.75 0.63
15.00
9.00 1.27
12.70
7.62 0.41 4.00
MAX
5.21 0.70 4.51 0.90 0.66 0.46 4.05 0.15 0.10 0.20 0.30 0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 77
A2
D
E
// bbb Z
Z
H2
H1
BGA 77 0113 REV D
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
LTMXXXXXX
µModule
DETAIL A
PACKAGE BOTTOM VIEW
3
SEE NOTES
A B C D E F G H J K L
PIN 1
e
b
F
G
7 6 5 4 3 2 1
SUGGESTED PCB LAYOUT
TOP VIEW
0.000
2.540 3.810 5.080
6.350 1.270 3.810 2.540 1.270 5.080 6.350
3.810
2.540
1.270
3.810
2.540
1.270
0.3175
0.3175
0.000
0.630 ±0.025 Ø 77x
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY
!
7
SEE NOTES
PACKAGE DESCRIPTION
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