Datasheet

LTM4644/LTM4644-1
2
Rev. F
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ABSOLUTE MAXIMUM RATINGS
V
IN
, SV
IN
(Per Channel) .............................. –0.3V to 15V
V
OUT
(Per Channel) (Note 3) ............–0.3V to SV
IN
or 6V
RUN (Per Channel) ..................................... –0.3V to 15V
INTV
CC
(Per Channel) ............................... –0.3V to 3.6V
PGOOD, MODE, TRACK/SS,
FB (Per Channel) ................................... –0.3V to INTV
CC
CLKOUT (Note 3), CLKIN .......................–0.3V to INTV
CC
Internal Operating Temperature Range (Note 2, 5)
E and I-Grade ..................................... –40°C to 125°C
MP-Grade .......................................... –55°C to 125°C
Storage Temperature Range .................. –65°C to 150°C
Peak Solder Reflow Body Temperature ................. 245°C
(Note 1)
BGA PACKAGE
77-LEAD (9mm × 15mm × 5.01mm)
1 2 3 4 5 6 7
B
C
D
E
F
G
H
J
K
L
A
TOP VIEW
V
OUT1
SV
IN1
MODE1
RUN1
COMP1
INTV
CC1
GND
PGOOD2 PGOOD1
INTV
CC2
PGOOD3
TEMP
INTV
CC3
PGOOD4
CLKOUT
FB1
TRACK/SS1
GND
CLKIN
TRACK/SS2
FB2
RUN2
SGND
TRACK/SS3
FB3
TRACK/SS4
INTV
CC4
RUN4
MODE2
SV
IN2
COMP2
RUN3
FB4
MODE3
SV
IN3
COMP3
COMP4
MODE4SV
IN4
V
IN4
V
IN1
GND
GND
GND
V
IN3
V
IN2
V
OUT4
V
OUT3
V
OUT2
T
JMAX
= 125°C, θ
JCtop
= 17°C/W, θ
JCbottom
= 2.75°C/W,
θ
JB
+ θ
BA
= 11°C/W, θ
JA
= 10°C/W
θ VALUES PER JESD 51-12
WEIGHT = 1.9g
PIN CONFIGURATION
PART NUMBER PAD OR BALL FINISH
PART MARKING*
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(SEE NOTE 2)DEVICE FINISH CODE
LT M 4644EY#PBF SAC305 (RoHS) LT M 4644Y e1 BGA 3 –40°C to 125°C
LT M 4644IY#PBF SAC305 (RoHS) LT M 4644Y e1 BGA 3 –40°C to 125°C
LT M 4644MPY#PBF SAC305 (RoHS) LT M4644Y e1 BGA 3 –55°C to 125°C
LT M 4644IY SnPb (63/37) LT M 4644Y e0 BGA 3 –40°C to 125°C
LT M 4644MPY SnPb (63/37) LT M 4644Y e0 BGA 3 –55°C to 125°C
LT M 4644EY-1#PBF SAC305 (RoHS) LT M 4644Y-1 e1 BGA 3 –40°C to 125°C
LT M 4644IY-1#PBF SAC305 (RoHS) LT M 4644Y-1 e1 BGA 3 –40°C to 125°C
LT M 4644IY-1 SnPb (63/37) LT M 4644Y-1 e0 BGA 3 –40°C to 125°C
Note: The LTM4644-1 does not include the internal top feedback resistor.
• Contact the factory for parts specified with wider operating temperature
ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
• LGA and BGA Package and Tray Drawings
ORDER INFORMATION
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