Datasheet
LTC6915
16
6915fb
package DescripTion
Typical applicaTion
Figure 6. A 2:1 Multiplexing Two LTC6915’s
with Daisy Chained Gain Control
Multiplexing Two LTC6915’s
Send a gain code of 0000 to one IC to set its output to a
high impedance state and send a gain code other than 0000
to the second IC to set it for normal amplification. If both
devices are ON, the 200Ω resistors protect the outputs.
The sense pin connection maintains gain accuracy for
loads 1k or greater.
SHDN
IN
–
IN
+
V
–
HOLD_THRU
CS
D
IN
CLK
V
+
OUT
SENSE
REF
NC
PAR_SER
DGND
D
OUT
LTC6915
#1
–5V
–5V
P
(TTL
LEVELS)
DATA
SELECT
CLOCK
0.1µF
0.1µF
5V
V
IN1
SHDN
IN
–
IN
+
V
–
HOLD_THRU
CS
D
IN
CLK
V
+
OUT
SENSE
REF
NC
PAR_SER
DGND
D
OUT
LTC6915
#2
–5V
–5V
0.1µF
0.1µF
5V
V
IN2
V
OUT
200Ω
200Ω
6915 F06
4.00 ±0.10
(2 SIDES)
3.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 ± 0.10
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
2.50 REF
16
127
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0806 REV D
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 ±0.05
0.70 ±0.05
3.60 ±0.05
PACKAGE
OUTLINE
3.30 ±0.10
0.25 ± 0.05
0.50 BSC
1.70 ± 0.05
3.30 ±0.05
0.50 BSC
0.25 ± 0.05
GN16 (SSOP) 0204
1 2
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
15
14
13
.189 – .196*
(4.801 – 4.978)
12 11 10
9
.016 – .050
(0.406 – 1.270)
.015 ±.004
(0.38 ±0.10)
× 45°
0° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165 ±.0015
.045 ±.005
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)