Datasheet

LTC6655
13
6655fa
Figure 10. Long-Term Drift
applicaTions inForMaTion
Figure 11. Hysteresis Plot –40°C to 125°C
V
IN
(V)
0
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
6655 F12
5
10
NO LOAD
15
POWER (W)
5mA LOAD
Figure 12. LTC6655-2.5 Power Consumption
V
IN
(V)
0
105
115
125
12
6655 F13
95
85
3 6 9 15
75
65
55
MAXIMUM AMBIENT
OPERATING TEMPERATURE (°C)
NO LOAD
5mA LOAD
Figure 13. LTC6655-2.5 Maximum
Ambient Operating Temperature
Hysteresis
Thermal hysteresis is a measure of change of output
voltage as a result of temperature cycling. Figure 11
illustrates the typical hysteresis based on data taken from
the LTC6655-2.5. A proprietary design technique minimizes
thermal hysteresis.
Power Dissipation
Power dissipation for the LTC6655 depends on V
IN
and
load current. Figure 12 illustrates the power consump-
tion versus V
IN
under a no-load and 5mA load condition
at room temperature for the LTC6655-2.5. Other voltage
options display similar behavior.
The MSOP8 package has a thermal resistance (θ
JA
)
equal to 300°C/W. Under the maximum loaded condition,
the increase in die temperature is over 35°C. If operated at
these conditions with an ambient temperature of 125°C,
the absolute maximum junction temperature rating of
the device would be exceeded. Although the maximum
junction temperature is 150°C, for best performance it
is recommended to not exceed a junction temperature
of 125°C. The plot in Figure 13 shows the recommended
maximum ambient temperature limits for differing V
IN
and
load conditions using a maximum junction temperature
of 125°C.
DISTRIBUTION (ppm)
–90
NUMBER OF UNITS
20
25
50
15
10
–50 –10
–70 90
–30 10
70
30 110
5
0
30
6655 F11
HOURS
0
LONG-TERM DRIFT (ppm)
40
80
120
2000
6655 F10
0
–40
–80
500
1000
1500
2500
4 TYPICAL UNITS
LTC6655-2.5