Datasheet

LTC6652
18
6652fe
For more information www.linear.com/6652
package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LS8 Package
8-Leadless Chip Carrier (5mm × 5mm)
(Reference LTC DWG # 05-08-1852 Rev Ø)
7
8
1
3
4
2
2.00 REF
R0.20 REF
6
5
7
8
6
5
1
2
3
4
4.20 ±0.10
4.20 SQ ±0.10
2.54 ±0.15
1.00 TYP
0.64 TYP
LS8 0609 REV Ø
R0.20 REF
0.95 ±0.10
1.45 ±0.10
0.10 TYP0.70 TYP
1
4
7
8
6
5
1.50 ±0.15
2.50 ±0.15
2.54 ±0.15
0.70 ±0.05
PACKAGE OUTLINE
5.00 SQ ±0.15
5.00 SQ ±0.15
5.80 SQ ±0.15
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS PACKAGE DO NOT INCLUDE PLATING BURRS
PLATING BURRS, IF PRESENT, SHALL NOT EXCEED 0.30mm ON ANY SIDE
4. PLATING—ELECTO NICKEL MIN 1.25UM, ELECTRO GOLD MIN 0.30UM
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(SEE NOTE 5)
2
3
LS8 Package
8-Pin Leadless Chip Carrier (5mm × 5mm)
(Reference LTC DWG # 05-08-1852 Rev Ø)