Datasheet

LTC6409
22
6409fa
package DescripTion
0.40 ± 0.10
0.50 ± 0.10
0.80
BSC
BOTTOM VIEW—EXPOSED PAD
SIDE VIEW
0.75 ±0.05
R = 0.13
TYP
0.20 REF
(UDB10) DFN 0910 REV A
0.70 ± 0.10
1
2
35
6
7
8 10
0.60 ± 0.10
3.00 ± 0.05
0.90 ± 0.10
DETAIL A
0.25 ± 0.10
0.05 ± 0.10
2.00 ± 0.05
DETAIL A
0.25 ± 0.05
0.50 BSC
0.00 – 0.05
0.90 ± 0.05
DETAIL B
0.25 ± 0.05
0.05 ± 0.05
0.25 ± 0.05
0.85 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.50 ±0.05
1.10 ±0.05
0.65 ±0.05
0.75 ±0.05
2.50 ±0.05
PACKAGE
OUTLINE
0.50 BSC
DETAIL B
0.95 ± 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
UDB Package
10-Lead Plastic QFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1848 Rev A)