Datasheet

LTC6246/LTC6247/LTC6248
18
624678fa
package DescripTion
KC Package
8-Lead Plastic UTDFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1749 Rev Ø)
2.00 p0.10
2.00 p0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
0.64 p 0.10
0.55 p0.05
R = 0.115
TYP
R = 0.05
TYP
1.35 REF
1.37 p 0.10
1
4
85
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.125 REF
0.00 – 0.05
(KC8) UTDFN 0107 REVØ
0.23 p 0.05
0.45 BSC
0.25 p 0.05
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.64 p0.05
1.37 p0.05
1.15 p0.05
0.70 p0.05
2.55 p0.05
PACKAGE
OUTLINE
0.45 BSC
PIN 1 NOTCH
R = 0.20 OR
0.25 s 45o
CHAMFER
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53 p 0.152
(.021 p .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 p 0.0508
(.004 p .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
1 2
3
4
4.90 p 0.152
(.193 p .006)
8
7
6
5
3.00 p 0.102
(.118 p .004)
(NOTE 3)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC